Image TB6560AHQ(O,8)
型号: TB6560AHQ(O,8)
厂商: Toshiba
标准:
分类: 半导体集成电路 - IC
描述: motor / motion / ignition controllers & drivers pwm choppertype 40v 3.5A 100kohm
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TB6560AHQ(O,8)的详细信息

Manufacturer: Toshiba
Product Category: Motor / Motion / Ignition Controllers & Drivers
RoHS: Yes
Brand: Toshiba
Product: Stepper Motor Controllers / Drivers
Type: Stepper Motor Driver
Operating Supply Voltage: 5 V
Operating Temperature: - 30 C to + 85 C
Mounting Style: Through Hole
Package / Case: HZIP
Packaging: Tray
Factory Pack Quantity: 500
TB6560AHQ/AFG  
TOSHIBA BiCD Integrated Circuit Silicon Monolithic  
TB6560AHQ, TB6560AFG  
PWM Chopper-Type Bipolar Driver IC for Stepping Motor Control  
The TB6560AHQ/AFG is a PWM chopper-type stepping motor  
driver IC designed for sinusoidal-input microstep control of  
TB6560AHQ  
bipolar stepping motors. The TB6560AHQ/AFG can be used in  
applications that require 2-phase, 1-2-phase, 2W1-2-phase and  
4W1-2-phase excitation modes. The TB6560AHQ/AFG is capable  
of low-vibration, high-performance forward and reverse driving of  
a two-phase bipolar stepping motor using only a clock signal.  
Features  
TB6560AFG  
Single-chip motor driver for sinusoidal microstep control of  
stepping motors  
High output withstand voltage due to the use of BiCD process:  
Ron (upper and lower sum) =  
TB6560AHQ: 0.6 Ω (typ.)  
TB6560AFG: 0.7 Ω (typ.)  
Forward and reverse rotation  
Selectable phase excitation modes (2, 1-2, 2W1-2 and 4W1-2)  
High output withstand voltage: V  
= 40 V  
DSS  
Weight  
High output current: I  
= TB6560AHQ: 3.5 A (peak)  
OUT  
HZIP25-P-1.27: 9.86 g (typ.)  
HQFP64-P-1010-0.50: 0.26 g (typ.)  
TB6560AFG: 2.5 A (peak)  
Packages: HZIP25-P-1.27  
HQFP64-P-1010-0.50  
Internal pull-down resistors on inputs: 100 kΩ (typ.)  
Output monitor pin: M current (I  
O
(max) = 1 mA)  
MO  
Reset and enable pins  
Thermal shutdown (TSD)  
*Solderability  
1. Use of Sn-37Pb solder bath  
*solder bath temperature = 230°C  
*dipping time = 5 seconds  
*number of times = once  
*use of R-type flux  
2. Use of Sn-3.0Ag-0.5Cu solder bath  
*solder bath temperature = 245°C  
*dipping time = 5 seconds  
*the number of times = once  
*use of R-type flux  
*: These ICs are highly sensitive to electrostatic discharge. When handling them, ensure that the environment is  
protected against electrostatic discharge. Ensure also that the ambient temperature and relative humidity are  
maintained at reasonable level.  
1
2011-01-18