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C-15-13-F02M-PD-SFCL |
Source Photonics, Inc. |
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1550nm emitting,1310nm receiving(pin-tia,5pin-out,3.3V) Bi-directional diplexer optical module |
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C-15-13-F04M-P-SFCL |
Source Photonics, Inc. |
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1550nm emitting,1310nm receiving(pin-tia,5pin-out,3.3V) Bi-directional diplexer optical module |
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C-15-13-F06M-P-SFCL |
Source Photonics, Inc. |
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1550nm emitting,1310nm receiving(pin-tia,5pin-out,3.3V) Bi-directional diplexer optical module |
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1SV272 |
Guangdong Kexin Industrial Co.,Ltd |
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transmitting receiving antenna-switch use pin diode |
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1SV268 |
Sanyo Semicon Device |
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transmitting, receiving antenna-switch use pin diode |
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1SV272 |
Sanyo Semicon Device |
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transmitting, receiving antenna-switch use pin diode |
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U4275B |
TEMIC Semiconductors |
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FM-receiving condition analyser and multipath noise cancellation |
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KF139S |
KEC(Korea Electronics) |
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specifications for saw filter(band pass filterS for the receiving RF circuits OF pager) |
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CXG1034TN |
Sony Corporation |
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receiving mixer |
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TC9134P |
Toshiba Semiconductor and Storage |
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32-function remote control receiving lsi |
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KF155S |
KEC(Korea Electronics) |
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specifications for saw filter(band pass filterS for the receiving RF circuits OF pager) |
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TORX177L |
Toshiba Semiconductor and Storage |
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fiber optic receiving module for digital audio interface |
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TORX177PL |
Toshiba Semiconductor and Storage |
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fiber optic receiving module for digital audio interface |
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TORX179P |
Toshiba Semiconductor and Storage |
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fiber optic receiving module |
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KF147S |
KEC(Korea Electronics) |
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specifications for saw filter(band pass filterS for the receiving RF circuits OF pager) |
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TORX179PL |
Toshiba Semiconductor and Storage |
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fiber optic receiving module |
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RX179ATW |
Ceramate Technical |
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fiber optic receiving module |
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TORX180 |
Toshiba Semiconductor and Storage |
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fiber optic receiving module for simplex digital signal transmission |
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PSR11D |
Kodenshi Corp |
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composed of a modulated infrared emitting diode at the light-emitting side and a modulated photo IC at the light receiving side |
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PSR11L |
Kodenshi Corp |
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composed of a modulated infrared emitting diode at the light-emitting side and a modulated photo IC at the light receiving side |