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BDN09-3CB/A01的详细信息
| Datasheets： | |
|---|---|
| Various Semiconductor Heat Sink： | |
| BDN Series Peel-Stick Heat Dissipators： | |
| Product Photos： | |
| BDN09-3CB/A01 Heat Sink： | |
| Product Training Modules： | |
| Low-Cost, High Performance Spartan®-3 Generation： | |
| RoHS Information： | |
| BDN Series RoHS Cert： | |
| Catalog Drawings： | |
| BDN09-3CB(^A01)： | |
| Standard Package ： | 300 |
| Category： | Fans, Thermal Management |
| Family： | Thermal - Heat Sinks |
| Series： | BDN |
| Type： | Top Mount |
| Package Cooled： | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method： | Thermal Tape, Adhesive (Included) |
| Shape： | Square, Pin Fins |
| Length： | 0.910" (23.11mm) |
| Width： | 0.910" (23.11mm) |
| Diameter： | - |
| Height Off Base (Height of Fin)： | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise： | - |
| Thermal Resistance @ Forced Air Flow： | 9.6°C/W @ 400 LFM |
| Thermal Resistance @ Natural： | 26.9°C/W |
| Material： | Aluminum |
| Material Finish： | Black Anodized |
| Dynamic Catalog： | BDN Series |
| Other Names： | 294-1097BDN093CB/A01 |
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