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Image HF115AC-0.0055-AC-105
型号:

HF115AC-0.0055-AC-105

厂商: Bergquist
标准:
分类: 热量管理热 - 垫,片
描述: therm pad sip pkg W/adh HI-flow
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HF115AC-0.0055-AC-105的详细信息

Datasheets:
Hi-Flow 115-AC:
Product Photos:
HF115AC-0.0055-AC-105:
Other Related Documents:
Sil-Pad Metric Configurations:
RoHS Information:
Hi-Flow 115-AC Material Report:
Catalog Drawings:
SIP_105:
Standard Package : 100
Category: Fans, Thermal Management
Family: Thermal - Pads, Sheets
Series: Hi-Flow® 115-AC
Usage: SIP
Shape: Rectangle
Outline: 36.83mm x 21.29mm
Thickness: 0.0055" (0.140mm)
Material: Phase Change Compound
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Color: Gray
Thermal Resistivity: 0.35°C/W
Thermal Conductivity: 0.8 W/m-K
Dynamic Catalog: Hi-Flow® 115-AC Series
Other Names: BER170HF115AC-105HF115AC00055AC105HF115TAAC-105