![]() |
Datasheet下载地址
本地下载 >> 厂商下载2 >> 第三方平台下载 >> |
IRF3205PBF的详细信息
Manufacturer: | International Rectifier |
---|---|
Product Category: | MOSFET |
RoHS: | Yes |
Transistor Polarity: | N-Channel |
Vds - Drain-Source Breakdown Voltage: | 55 V |
Vgs - Gate-Source Breakdown Voltage: | 20 V |
Id - Continuous Drain Current: | 98 A |
Rds On - Drain-Source Resistance: | 8 mOhms |
Qg - Gate Charge: | 97.3 nC |
Pd - Power Dissipation: | 150 W |
Mounting Style: | Through Hole |
Package / Case: | TO-220-3 |
Packaging: | Tube |
Brand: | International Rectifier |
Factory Pack Quantity: | 50 |
PD-94791B
IRF3205PbF
HEXFET® Power MOSFET
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
D
VDSS = 55V
RDS(on) = 8.0mΩ
G
l Fully Avalanche Rated
l Lead-Free
ID = 110Aꢀ
S
Description
Advanced HEXFET® Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well known
for, provides the designer with an extremely efficient and
reliable device for use in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrialapplicationsatpowerdissipationlevels
to approximately 50 watts. The low thermal resistance and
low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
TO-220AB
Absolute Maximum Ratings
Parameter
Max.
110 ꢀ
80
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
A
390
PD @TC = 25°C
Power Dissipation
200
W
W/°C
V
Linear Derating Factor
1.3
VGS
IAR
Gate-to-Source Voltage
± 20
Avalanche Current
62
A
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
20
mJ
V/ns
5.0
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
°C
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Thermal Resistance
Parameter
Junction-to-Case
Typ.
–––
Max.
Units
RθJC
RθCS
RθJA
0.75
–––
62
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
0.50
–––
°C/W
www.irf.com
1
07/23/10
IRF3205PBF相关文档
扫码用手机查看Datasheet
更方便
扫码关注嵌入式ARM

同类器件
新增器件
-
外包服务器软件
预算:¥100002021-01-20
-
优化代写stm32+stm8程序
预算:¥25002天前
-
PC端上位机开发
预算:¥100001天前
-
索尼CMOS的调试:IMX482
预算:¥1500002小时前
-
单片机用sd卡记录AT指令项目
预算:¥1000010小时前
-
英飞凌芯片烧录
预算:¥1000010小时前