 |
ON Semiconductor 
Datasheet下载地址
| 本地下载 >> 厂商下载2 >> 第三方平台下载 >> |
MC100LVEL12DG的详细信息
| Manufacturer： | ON Semiconductor |
|---|---|
| Product Category： | Buffers & Line Drivers |
| RoHS： | Yes |
| Brand： | ON Semiconductor |
| Number of Input Lines： | 2 |
| Number of Output Lines： | 4 |
| Polarity： | Non-Inverting |
| Supply Voltage - Max： | 3.8 V |
| Supply Voltage - Min： | 3 V |
| Maximum Operating Temperature： | + 85 C |
| Mounting Style： | SMD/SMT |
| Package / Case： | SOIC-8 Narrow |
| Packaging： | Tube |
| High Level Output Current： | - 50 mA |
| Logic Family： | 100LV |
| Logic Type： | ECL Low Impedance Driver |
| Low Level Output Current： | 50 mA |
| Minimum Operating Temperature： | - 40 C |
| Number of Channels per Chip： | 1 |
| Output Type： | ECL |
| Propagation Delay Time： | 0.58 ns |
| Series： | MC100LVEL12 |
| Factory Pack Quantity： | 98 |
| Supply Current： | 17 mA |
MC100LVEL12DG相关文档
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Application Note: Interfacing with ECLinPS™
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
- Application Note: Interfacing Between LVDS and ECL
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Package Drawing: SOIC-8 Narrow Body
- Application Note: Clock Management Design Using Low Skew and Low Jitter Devices
- Application Note: AC Characteristics of ECL Devices
- Application Note: Designing with PECL (ECL at +5.0 V)
- Application Note: Termination of ECL Logic Devices
- Package Drawing: DFN8 2.0x2.0x0.9mm, 0.5p
- Simulation Model: Low Voltage ECLinPS SPICE Modeling Kit
- Simulation Model: IBIS Model for MC100LVEL12DW 3.3V
- Application Note: Phase Lock Loop General Operations
- Application Note: ECL Clock Distribution Techniques
- Application Note: The ECL Translator Guide
- Package Drawing: TSSOP 8 3.0x3.0x0.95 mm
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Application Note: Using Wire-OR Ties in ECLInPS Designs
扫码手机查看更方便
同类器件
