MC10H351PG的详细信息
Manufacturer: | ON Semiconductor |
---|---|
Product Category: | Translation - Voltage Levels |
RoHS: | Yes |
Brand: | ON Semiconductor |
Type: | NMOS/TTL to PECL |
Propagation Delay Time: | 2.2 ns |
Supply Voltage - Max: | 5.25 V |
Supply Voltage - Min: | 4.75 V |
Maximum Operating Temperature: | + 75 C |
Mounting Style: | Through Hole |
Package / Case: | PDIP-20 |
Minimum Operating Temperature: | 0 C |
Packaging: | Tube |
Factory Pack Quantity: | 18 |
MC10H351PG相关文档
- Application Note: Phase Lock Loop General Operations
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Package Drawing: SOEIAJ-20
- Application Note: AC Characteristics of ECL Devices
- Application Note: Designing with PECL (ECL at +5.0 V)
- Simulation Model: H124, 125, 350-352 Translator I/O SPICE Modelling Kit
- Package Drawing: Ceramic DIP 20-Lead
- Application Note: Interfacing Between LVDS and ECL
- Application Note: Termination of ECL Logic Devices
- Package Drawing: 20 LEAD PLLC
- Application Note: Clock Management Design Using Low Skew and Low Jitter Devices
- Simulation Model: IBIS Model for mc10h351p 5.0V
- Package Drawing: 20 LEAD PDIP
- Application Note: Using Wire-OR Ties in ECLInPS Designs
- Application Note: The ECL Translator Guide
- Application Note: ECL Clock Distribution Techniques
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Application Note: Family Characteristics for MECL 10H™ and MECL 10K™
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Application Note: Interfacing with ECLinPS™
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
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