关键词stresses
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为您共找出"10"个相关器件
图片 型号 厂商 标准 分类 描述
Image: 1N5221B 1N5221B Fairchild Semiconductor 半导体 单二极管/齐纳 stresses exceeding the absolute maximum ratings may damage the device.
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X432J5JACTU C0603X432J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752G5JACTU C0603X752G5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.

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