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为您共找出"317"个相关器件
图片 型号 厂商 标准 分类 描述
Image: MC56F844XX MC56F844XX NXP Semiconductors 集成电路 嵌入式 -  微控制器或微处理器模块 this family of digital signal controllers (dscs) is based on the 32-bit 56800ex core.
Image: A2T08VD020N A2T08VD020N NXP Semiconductors 半导体 RF 晶体管 (BJT) this 2 W RF power ldmos transistor is designed for cellular base stationapplications covering the frequency range of 728 to 960 mhz.
Image: MMA8452Q MMA8452Q NXP Semiconductors 传感器，变送器 电容触摸传感器 the mma8452q is a smart, low-power, three-axis, capacitive, micromachined accelerometer with 12 bits of resolution. this accelerometer is packed with
Image: LT6023 LT6023 Linear Technology 嵌入式解决方案 评估板 - 运算放大器 the LT®6023 is a low power, enhanced slew rate, precision operational amplifier. the proprietary circuit topology of this amplifier gives excellent slew rate at low quiescent power dissipation without compromising precision orsettling time
Image: NCL30030 NCL30030 ON Semiconductor 嵌入式解决方案 评估板 -  LED 驱动器 this combination IC integrates power factor correction (pfc) and quasi−resonant flyback functionality necessary to implement a compact and highly efficient led driver for high performance led lighting applications.
Image: BU9414FV BU9414FV Rohm Semiconductor 集成电路 嵌入式 - DSP（数字式信号处理器） this lsi is the digital sound processor which made the use digital signal processing for fpd tvs.
Image: 67-21S 67-21S Everlight 光电子 LED 照明 - 白色 the everlight 67-21s package has high efficacy, high cri, low power consumption, wide viewing angle and a compact form factor. these features make this package an ideal led for all lighting applications.
Image: HLMP-2899 HLMP-2899 Agilent(Hewlett-Packard) 光电子 边框 this series of black plastic bezel mounts is designed to install agilent light bars in instrument panels ranging in thickness from 1.52 mm (0.060 inch) to 3.18 mm (0.125 inch).
Image: BL1800 BL1800 Digi International 嵌入式解决方案 单板计算机（SBC） No part of the contents of this manual may be reproduced or transmitted in any form or by any means without the express written permission of digi international.
Image: CXA-L0505-NJL CXA-L0505-NJL TDK-Lambda 光电子 反相器 this means that, in conformity with EU directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, pbb and pbde, have not been used, except for exempted applications
Image: M0220SD‐202SDAR1 M0220SD‐202SDAR1 Newhaven Display International, Inc. 光电子 显示器模块 - 真空荧光(VFD) this vacuum uorescent display (vfd) module consists of a 20 character by 2 line 5×8 dot matrix display, DC-DC/AC converter, and controller/driver circuitry
Image: TBS1T2A1MZRES TBS1T2A1MZRES TE Connectivity 机电产品 拨动开关 this drawing IS A controllde document.
Image: 1763 1763 ETC 连接器 存储器连接器 - PC 卡 - 适配器 adding shortening to a Pi makes it fatter - but this kind of shortening makes your Pi a little slimmer!
Image: ORWH-SH-112D,N000 ORWH-SH-112D,N000 TE Connectivity 机电产品 功率继电器，高于 2 A this drawing IS A controlled document
Image: LCMXO3LF-6900C-S-EVN LCMXO3LF-6900C-S-EVN Lattice Semiconductor Corporation 嵌入式解决方案 评估板 - 嵌入式 - 复杂逻辑器件 (FPGA, CPLD) this user’s guide describes how to start using the machxo3 starter kit, an easy-to-use platform for evaluating and designing with the machxo3 ultra-low density fpga.
Image: BOB-11044 BOB-11044 ETC 嵌入式解决方案 评估板 - 音频放大器 this tiny audio amplifier is based on the texas instruments tpa2005d1.
Image: FEBFMT1030_MEMS01 FEBFMT1030_MEMS01 Fairchild Semiconductor 嵌入式解决方案 评估板 - 传感器 this user guide describes the evaluation kit for the fmt1030
Image: KIT_MLCC_AUTOMOTIVE KIT_MLCC_AUTOMOTIVE Samsung Electro-Mechanics America, Inc 附件 电容器套件 this capacitor with derating is designed for 70% of the rated voltage or less
Image: 1207651 1207651 Phoenix Contact 附件 DIN 导轨通道 please be informed that the data shown in this pdf document is generated from our online catalog. please find the complete data in the user's documentation.
Image: RBK-105-NR5020/A-X-8MM RBK-105-NR5020/A-X-8... Tyco Electronics 附件 热缩管套件 this specification covers the requirements for one type of flexible, electrical insulating, extruded tubing whose diameter will reduce to a predetermined size upon the application of heat in excess of 121°C (250°F).

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