关键词bumpe
- 标准
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| 图片 | 型号 | 厂商 | 标准 | 分类 | 描述 |
|---|---|---|---|---|---|
|
27312 | Parallax | 嵌入式解决方案 配件 | kit bumper sensors toddler toes | |
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SL2ICS1001DW/V4,00 | NXP Semiconductors | |
半导体 集成电路(IC) | 数据转换系统 smrt label IC bumped wafer specification |
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KGEA-BA-C-0094J | PREMO CORPORATION S.L | keyless go emitter bumper antenna | ||
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KGEA-BA-C-0141J | PREMO CORPORATION S.L | keyless go emitter bumper antenna | ||
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ATA555814-DBB | Atmel | 半导体 集成电路(IC) | 射频无线杂项 210pf bumped | |
|
TLV5614IYZ | Texas Instruments | |
半导体 | 2.7 V to 5.5V 12-bit lead-free/green dac in bumped-die (wafer chip scale) package 16-dsbga -40 to 85 |
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MF1ICS2005 | NXP Semiconductors | sawn bumped 120レm wafer addendum | ||
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MF1ICS2005U7D | NXP Semiconductors | sawn bumped 120レm wafer addendum | ||
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MF1ICS2005W7D | NXP Semiconductors | sawn bumped 120レm wafer addendum | ||
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MF1ICS5005 | Philips Semiconductors | standard card IC specification “bumped sawn wafer on UV-tape” | ||
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MF1ICS5005V1D | Philips Semiconductors | standard card IC specification “bumped sawn wafer on UV-tape” | ||
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MF1ICS5005W1D | Philips Semiconductors | standard card IC specification “bumped sawn wafer on UV-tape” |
