关键词metal
标准
为您共找出"500+"个相关器件
图片 型号 厂商 标准 分类 描述
Image: 1N5924BUR-1 1N5924BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 1N5915BUR-1 1N5915BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 1N5916BUR-1 1N5916BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 1N5926BUR-1 1N5926BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 1N5917BUR-1 1N5917BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 1N5918BUR-1 1N5918BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 1N5919BUR-1 1N5919BUR-1 Microsemi Corporation metallurgically bonded glass surface mount 1.5 watt zeners
Image: 0528304412 0528304412 Molex modular jack, right angle, 4/2, 0.10??m (4??") gold (Au) plating, with beveled metalpins, tray packaging, lead-free
Image: CFY25-23 CFY25-23 Siemens Semiconductor Group gaas fet (low noise high gain for front-end amplifiers lon-implanted planar structure all gold metallization)
Image: D2022UK D2022UK Sames gold metallised multi-purpose silicon dmos RF fet 45w - 28v - 500mhz push-pull
Image: CFY25-17 CFY25-17 Siemens Semiconductor Group gaas fet (low noise high gain for front-end amplifiers lon-implanted planar structure all gold metallization)
Image: CFY25-20 CFY25-20 Siemens Semiconductor Group gaas fet (low noise high gain for front-end amplifiers lon-implanted planar structure all gold metallization)
Image: 0528304422 0528304422 Molex modular jack, right angle, 4/4, 0.38??m (15??") gold (Au) plating, with beveled metalpins, tray packaging, lead-free
Image: 0528304432 0528304432 Molex modular jack, right angle, 4/4, 0.76??m (30??") gold (Au) plating, with beveled metalpins, tray packaging, lead-free
Image: 1N967A 1N967A Microsemi Corporation metallurgically bonded double plug construction
Image: 1N967 1N967 Microsemi Corporation metallurgically bonded double plug construction
Image: 1N967B 1N967B Compensated Deuices Incorporated metallurgically bonded
Image: 1N961A 1N961A Microsemi Corporation metallurgically bonded double plug construction
Image: 1N961C 1N961C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N961B 1N961B Compensated Deuices Incorporated metallurgically bonded

©2000-  21IC电子网版权所有

京ICP备11013301号 京公网安备 11010802024343号