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87914-4216 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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87914-4816 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 48 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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87914-4416 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 44 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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550T007M |
Glenair |
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emi/rfi D-subminiature split backshell with pre-terminated overall shield sock |
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87957-1005 |
Molex |
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2.50mm (.098) pitch header, right angle, through hole, 5 circuits, tin (Sn) overall Plating, tray packaging, lead-free |
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87957-1010 |
Molex |
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2.50mm (.098) pitch header, right angle, through hole, 10 circuits, tin (Sn) overall Plating, tray packaging, lead-free |
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87957-1004 |
Molex |
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2.50mm (.098) pitch header, right angle, through hole, 4 circuits, tin (Sn) overall Plating, tray packaging, lead-free |
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87898-2426 |
Molex |
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2.54mm (.100) pitch KK? header, surface mount, breakaway, vertical, 24 circuits, tin (Sn) overall Plating, tube packaging, without cap, lead- free |
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87898-2626 |
Molex |
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2.54mm (.100) pitch KK? header, surface mount, breakaway, vertical, 26 circuits, tin (Sn) overall Plating, tube packaging, without cap, lead- free |
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0757570362 |
Molex |
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3.50mm (.138) pitch, mx150? header, breakaway, vertical, 6 circuits, 1.25??m (50??) nickel (Ni) overall, 2.50??m (100??) minimum select matte tin (Sn) Plating on tail |
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0757570361 |
Molex |
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3.50mm (.138") pitch, mx150? header, breakaway, vertical, 6 circuits, 1.25??m (50??") nickel (Ni) overall, 2.50??m (100??") minimum select matte tin (Sn) Plating on tail |
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0879144416 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 44 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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0482036362 |
Molex |
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high density, ddc compatible D-subminiature shielded I/O pcb female receptacle,right angle, through hole, 44 circuits, flush insert only, black housing, overall gold (Au) flash plating, lead free |
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CGY96 |
Siemens Semiconductor Group |
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gaas mmic (power amplifier for gsm class 4 phones 3.2 W 35dbm output power at 3.5 V overall power added efficiency 50%) |
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Q62702G63 |
Siemens Semiconductor Group |
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gaas mmic (power amplifier for gsm class 4 phones 3.2 W 35dbm output power at 3.5 V overall power added efficiency 50%) |
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0879144616 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 46 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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0879144816 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 48 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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0879144216 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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75757-0422 |
Molex |
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3.50mm (.138") pitch, mx150 header, breakaway, vertical, 2 circuits, 1.25um (50u") nickel (Ni) overall |
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75757-6221 |
Molex |
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3.50mm (.138") pitch, mx150? header, breakaway, vertical, 4 circuits, 1.25??m (50??")nickel (Ni) overall, 2.50??m (100??") minimum select matte tin (Sn) Plating on tail, |
