关键词packa
标准
为您共找出"500+"个相关器件
图片 型号 厂商 标准 分类 描述
Image: M14128 M14128 STMicroelectronics memory micromodules general Information for D1, D2 and C packaging
Image: MIC4126 MIC4126 Micrel Inc 集成电路 dual 1.5A-peak low-side mosfet drivers in advanced packaging
Image: MIC4128 MIC4128 Micrel Inc 半导体 dual 1.5A-peak low-side mosfet drivers in advanced packaging
Image: 67492-1922 67492-1922 Molex 1.27mm (.050") pitch serial ata host receptacle, right angle, smt, mating height3.55mm (.140"), 0.38??m (15??") gold (Au) plating, without cap, embossed tape onreel packaging, 22 circuits, lead free
Image: 67492-1920 67492-1920 Molex 1.27mm (.050") pitch serial ata host receptacle, right angle, smt, mating height3.55mm (.140"), gold (Au) flash, without cap, embossed tape on reel packaging, 22circuits, lead free
Image: 67492-1830 67492-1830 Molex 1.27mm (.050") pitch serial ata host receptacle, right angle, smt, mating height 5.60mm (.220"), gold (Au) flash, with cap, embossed tape on reel packaging, 22 circuits, lead free
Image: 67492-1326 67492-1326 Molex 1.27mm (.050") pitch serial ata host receptacle, right angle, smt, mating height5.25mm (.207"), 0.76??m (30??") gold (Au) plating, 22 circuits, with cap, embossedtape on reel packaging, lead free
Image: 67492-1930 67492-1930 Molex 1.27mm (.050") pitch serial ata host receptacle, right angle, smt, mating height3.55mm (.140"), gold (Au) flash, with cap, embossed tape on reel packaging, 22circuits, lead free
Image: 67492-1122 67492-1122 Molex 1.27mm (.050") pitch serial ata host receptacle, right angle, smt, mating height3.55mm (.140"), 0.38??m (15??") gold (Au) plating, tray packaging, 22 circuits, leadfree
Image: MIC4127YML MIC4127YML Micrel Inc 半导体 dual 1.5A-peak low-side mosfet drivers in advanced packaging
Image: MIC4128YML MIC4128YML Micrel Inc 半导体 dual 1.5A-peak low-side mosfet drivers in advanced packaging
Image: MIC4127 MIC4127 Micrel Inc 集成电路 dual 1.5A-peak low-side mosfet drivers in advanced packaging
Image: ST1336 ST1336 STMicroelectronics memory micromodules general Information for D1, D2 and C packaging
Image: ST1333 ST1333 STMicroelectronics memory micromodules general Information for D1, D2 and C packaging
Image: 67130-0806 67130-0806 Molex 1.27mm (.050") card bus header: one slot, flush profile, top mount, right anglesmt, with mylar, embossed tape on reel packaging, lead-free
Image: 67130-0809 67130-0809 Molex 1.27mm (.050") PC card header: single slot, flush profile, top mount, right angle,smt, with mylar, tray packaging, lead-free
Image: 87868-1401 87868-1401 Molex 1.60mm (.063) pitch board-to-board panel detachable, pcb receptacle, right angle, 14 circuits, gold (Au) plating, lubrication, tray packaging, lead-free
Image: 87898-2066 87898-2066 Molex 2.54mm (.100) pitch KK? header, surface mount, breakaway, vertical, 20 circuits, 2.50??m (98??) tin (Sn) Plating, tube packaging, without cap, lead-free
Image: 87891-1817 87891-1817 Molex 2.54mm (.100) pitch KK? header, through hole, breakaway, vertical, 18 circuits, 2.50??m (100??) tin (Sn) Plating, with cap, tape on reel packaging, lead-free
Image: 87957-1005 87957-1005 Molex 2.50mm (.098) pitch header, right angle, through hole, 5 circuits, tin (Sn) overall Plating, tray packaging, lead-free