关键词packag
标准
为您共找出"500+"个相关器件
图片 型号 厂商 标准 分类 描述
Image: TPS77233DGKRG4 TPS77233DGKRG4 Texas Instruments 150-mA ldo regulators with 8-pin msop packaging
Image: HP5-189S-1.27DS HP5-189S-1.27DS Hirose Electric Co Ltd high-density packaging system
Image: HP5-75P-1.27DS HP5-75P-1.27DS Hirose Electric Co Ltd high-density packaging system
Image: HP5-75P-1.27W HP5-75P-1.27W Hirose Electric Co Ltd high-density packaging system
Image: HP6-189S-1.27DS HP6-189S-1.27DS Hirose Electric Co Ltd high-density packaging system
Image: TPS62305DRCRG4 TPS62305DRCRG4 Texas Instruments 500-mA, 3-mhz synchronous step-down converter IN chip scale packaging
Image: TPS62302DRCRG4 TPS62302DRCRG4 Texas Instruments 500-mA, 3-mhz synchronous step-down converter IN chip scale packaging
Image: TPS62651YFF TPS62651YFF Texas Instruments 半导体 800-mA 6-mhz high-efficiency step-down converter with i2ctm compatible interface IN chip scale packaging
Image: TPS62351YZG TPS62351YZG Texas Instruments 半导体 800-mA, 3-mhz synchronous step-down converter with i2c⑩ compatible interface IN chip scale packaging
Image: TEMD5 TEMD5 ROHM Semiconductor packaging specifications
Image: TPS62601YFF TPS62601YFF Texas Instruments 半导体 500-mA, 6-mhz synchronous step-down converter IN chip scale packaging
Image: 0879144616 0879144616 Molex 2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 46 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free
Image: 0879144816 0879144816 Molex 2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 48 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free
Image: 0879144204 0879144204 Molex 2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 0.38??m (15??) gold (Au) plating, tray packaging, lead-free
Image: 0879144201 0879144201 Molex 2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 0.38??m (15??) gold (Au) plating, tray packaging, lead-free
Image: 0879144216 0879144216 Molex 2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free
Image: 87920-8147 87920-8147 Molex 2.54mm (.100) pitch C-grid? header, surface mount, dual row, vertical, 14 circuits, 0.38??m (15??) gold (Au) plating, with pick-and-place cap, with peg, tube packaging
Image: 0879114611 0879114611 Molex 2.54mm (.100) pitch C-grid? header, right angle, through hole, 46 circuits, 0.38??m (15??") gold (Au) selective plating, tube packaging, lead-free
Image: UMD4 UMD4 ROHM Semiconductor packaging specifications
Image: UMD5 UMD5 ROHM Semiconductor packaging specifications

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