|   | BGA616 BOARD | Infineon Technologies |   | 无源元器件
        
        RF 评估和开发套件,板 | board appl populated bga616 | 
    |   | W83627EEF | Winbond Electronics |  |  | evolving product from winbonds most popular I/O family | 
    |   | W83627EEG | Winbond Electronics |  |  | evolving product from winbonds most popular I/O family | 
    |   | W83627EHF | Winbond Electronics |  |  | evolving product from winbonds most popular I/O family | 
    |   | W83627EHG | Winbond Electronics |  |  | evolving product from winbonds most popular I/O family | 
    |   | 020167MR004S1ZA | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S2ZR | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S3ZR | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S3ZA | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S6ZA | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S6ZR | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S5ZA | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S5ZR | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S2ZA | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S4ZR | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S1ZR | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | 020167MR004S4ZA | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | ACT86LCSMX | Advanced Crystal Technology |  |  | a low cost version of our popular the surface mount, | 
    |   | 020167MR004SX00ZX | SUYIN USA, INC. |  |  | usb series A, R/A triple popt dip type | 
    |   | W83877ATD | Winbond Electronics |  |  | enhanced version from winbonds most popular I/O chip w83877f |