|   | ECQV1H824JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | T7237A | Agere Systems |  |  | compliance with the new etsi psd requirement | 
    |   | T7256A | Agere Systems |  |  | compliance with the new etsi psd requirement | 
    |   | T7234A | Agere Systems |  |  | compliance with the new etsi psd requirement | 
    |   | NTE1320 | NTE Electronics |  |  | integrated circuit module, hybrid, audio power amp, 25w, 2 power supplies required | 
    |   | NTE1330 | NTE Electronics |  |  | integrated circuit module - hybrid, dual, audio power amplifier, 15w/Ch, 2 power supplies required | 
    |   | NTE1331 | NTE Electronics |  |  | integrated circuit module - dual, audio power amplifier, 25w/channel, 2 power supplies required | 
    |   | NTE1345 | NTE Electronics |  |  | integrated circuit module, hybrid, dual audio power amp, 30w/Ch, 2 power supplies required | 
    |   | NTE1347 | NTE Electronics |  |  | integrated circuit module, hybrid, dual audio power amp, 20w/Ch, 2 power supplies required | 
    |   | ECQV1H123JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H124JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H125JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H153JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H154JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H223JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H224JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H273JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H274JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H333JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. | 
    |   | ECQV1H334JL | Panasonic Semiconductor |  |  | designed for application where high density insertion of components is required. |