|   | 4B88ABH1K09600 | Laird Technologies EMI |   | 无源元器件
        
        RFI 和 EMI - 屏蔽和吸收材料 | GK nicu nrs PU V0 bell | 
    |   | 4633-AF-51H-01800 | Laird Technologies |  | 无源元器件
        
        EMI/RFI 器件 | emi 垫圈与接地垫 fabricoverfoam bell L 18 xW .30 xH .10 | 
    |   | MTMMC-C-N12.R2 | Multi-Tech Systems |  | 嵌入式解决方案
        
        射频/无线模块和开发工具 | wifi/802.11 模块和开发工具 800/1900 cdma 1xrtt bell mob mmcmodem-5V | 
    |   | MTMMC-C-N12.R2-SP | Multi-Tech Systems |  | 嵌入式解决方案
        
        射频/无线模块和开发工具 | wifi/802.11 模块和开发工具 800/1900 cdma 1xrtt bell mob mmcmodem-5V | 
    |   | 4882-AB-51H-01800 | Laird Technologies |  | 无源元器件
        
        EMI/RFI 器件 | emi 垫圈与接地垫 fabricoverfoam bell L 18 xW .60 xH .12 | 
    |   | 73K222AL-IGT | TDK |  |  | V.22, V.21, bell 212a, 103 single-chip modem | 
    |   | 73K222AL-IP | TDK |  |  | V.22, V.21, bell 212a, 103 single-chip modem | 
    |   | 73K222AL-IH | TDK |  |  | V.22, V.21, bell 212a, 103 single-chip modem | 
    |   | 73K222AL | TDK |  |  | V.22, V.21, bell 212a, 103 single-chip modem | 
    |   | KA2410 | Samsung semiconductor |  |  | the ka2410/ka2411 IS A bipolar integrated circuit designed for telephone bell replacement | 
    |   | KA2411 | Samsung semiconductor |  |  | the ka2410/ka2411 IS A bipolar integrated circuit designed for telephone bell replacement | 
    |   | M60 | ETC |  |  | door bell dual tone | 
    |   | M602 | ETC |  |  | door bell dual tone | 
    |   | M602P | ETC |  |  | door bell dual tone | 
    |   | M60P | ETC |  |  | door bell dual tone | 
    |   | M3D-95 | ETC |  |  | 3 state dual tones wireless door bell | 
    |   | M3E.-H | ETC |  |  | 3 state dual tones wireless door bell | 
    |   | MT3530 | Zarlink Semiconductor Inc |  |  | bell 103/V.21 single chip modem | 
    |   | MT3530BE | Zarlink Semiconductor Inc |  |  | bell 103/V.21 single chip modem | 
    |   | 73K324L | ETC |  |  | ccitt V.22bis, V.22, V.21, V.23, bell 212a single-chip modem |