关键词fail
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图片 型号 厂商 标准 分类 描述
Image: CY23FS08OI CY23FS08OI Cypress Semiconductor Corp failsafe 2.5V/ 3.3V zero delay buffer
Image: CY23FS08OIT CY23FS08OIT Cypress Semiconductor Corp failsafe 2.5V/ 3.3V zero delay buffer
Image: SP1486E SP1486E Sipex Corporation +5V, 20mbps profibus rs485/rs422 transceivers advanced failsafe, 1/8th unit load, 【15kv esd-protected
Image: SP1486EEN-L SP1486EEN-L Sipex Corporation +5V, 20mbps profibus rs485/rs422 transceivers advanced failsafe, 1/8th unit load, 【15kv esd-protected
Image: SP1486EMN-L SP1486EMN-L Sipex Corporation +5V, 20mbps profibus rs485/rs422 transceivers advanced failsafe, 1/8th unit load, 【15kv esd-protected
Image: G3PC_07 G3PC_07 Omron Electronics ssr with failure detection function
Image: G3PC-220B-VD G3PC-220B-VD Omron Electronics ssr with failure detection function
Image: PCA9541A PCA9541A NXP Semiconductors 集成电路 接口 - 模块 the pca9541a is a 2-to-1 i2c-bus master selector designed for high reliability dual master i2c-bus applications where system operation is required, even when one master fails or the controller card is removed for maintenance
Image: PLED6N PLED6N Littelfuse Inc 电路保护 照明保护 the open led protector provides a switching electronic shunt path when a single led in an led string fails as an open circuit.
Image: LSP05G240PX3333 LSP05G240PX3333 Littelfuse Inc 电路保护 LED保护设备 It has been developed with littelfuse’s thermally protected varistor technology. its built-in thermal disconnect function provides additional protection to prevent catastrophic failure and fire hazard even under extreme circumstances of varistor end-oflife or sustained over-voltage conditions.
Image: RP-SMTT64DA1 RP-SMTT64DA1 Panasonic 嵌入式解决方案 存储卡 If you think about the usage for which special quality or reliability of the products is needed and failure or malfunction of the products may directly threaten life or injury for the special usage (aeronautic or cosmic usage, military usage, combustion machine, life support applications or safety applications), please counsel with our contacts in advance.
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103J8JACTU C0603X103J8JACTU Kemet 无源元器件 电容器 the addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X432J5JACTU C0603X432J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccsflex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.