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UMD6 |
ROHM Semiconductor |
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半导体
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packaging specifications |
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0527461171 |
Molex |
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0.50mm (.020") pitch ffc/fpc connector, right angle, smt, zif, bottom contactStyle, 11 circuits, lead-free, gold contact plating, high barrier packaging |
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SGM4684XG/TR |
Shengbang Microelectronics Co, Ltd |
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chip scale packaging, low-voltage 0.4??, dual, spdt analog switch |
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UMD2 |
ROHM Semiconductor |
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packaging specifications |
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SGM4684 |
Shengbang Microelectronics Co, Ltd |
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chip scale packaging, low-voltage 0.4??, dual, spdt analog switch |
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EMD5 |
ROHM Semiconductor |
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半导体
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packaging specifications |
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0876021191 |
Molex |
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2.50mm(.098") pitch panel detachable connector, pcb header, vertical, 12 circuits0.5??m (20??") gold (Au) selective plating, with locating pegs, tube packaging, leadfree |
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0879112211 |
Molex |
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2.54mm (.100) pitch C-grid? header, right angle, through hole, 22 circuits, 0.38??m (15??) gold (Au) selective plating, tube packaging, lead-free |
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52207-2960 |
Molex |
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1.00mm (.039") pitch ffc/fpc connector, smt, right angle, zif, top contact stylereceptacle, 29 circuits, lead-free, gold contact plating, high barrier packaging |
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0536250574 |
Molex |
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0.635mm (.025") pitch Slimstack? header, surface mount, dual row, Verticalstacking, 13.00mm (.512") stack height, lead-free, 50 circuits, with embossed Tapewith cover packaging |
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MR25MPA-10K-F |
RFE international |
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packaging specifications avisert (av3) & panasert (PA) specifications |
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MR25MAV3-10K-F |
RFE international |
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packaging specifications avisert (av3) & panasert (PA) specifications |
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643221359 |
Molex |
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female terminal, tin plated, selective 0.8??m gold in contact area, for square 0.6mm x 0.6mm pins, wire size 0.22mm?; to 0.44mm?awg, packaging on reel - "in laddestrip pitch 7.0mmr |
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0522711379 |
Molex |
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1.00mm (.039") pitch ffc/fpc connector, right angle, smt, zif, bottom contactstyle, 13 circuits, lead-free, high barrier packaging |
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643221339 |
Molex |
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female terminal, tin plated, selective 0.8??m gold in contact area, for square 0.6mmx 0.6mm pins, wire size 0.75mm? awg, packaging on reel - "in ladder strip pitch7.0mm" |
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0522711879 |
Molex |
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1.00mm (.039") pitch ffc/fpc connector, right angle, smt, zif, bottom contactstyle, 18 circuits, lead-free, high barrier packaging |
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TPS62674YFD |
Texas Instruments |
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半导体
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500-mA, 6-mhz high-efficiency step-down converter IN low profile chip scale packaging |
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TO-220 |
ROHM Semiconductor |
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packaging specifications |
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TPS61256 |
Texas Instruments |
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半导体
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3.5-mhz high efficiency step-Up converter In chip scale packaging. 5V output voltage 9-dsbga -40 to 85 |
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TPS62690 |
Texas Instruments |
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半导体
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500-mA, 4-mhz, 2.85-vout high-efficiency step-down converter in chip scale packaging 6-dsbga -40 to 85 |
