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K164 |
Siemens Semiconductor Group |
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temperaturmessung bedrahtete scheiben |
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TLP2404 |
Toshiba Semiconductor and Storage |
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半导体
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ipm (intelligent power module) industrial inverter operate at high ambient temperatures up to 125??C |
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1N821A |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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1N827 |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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1N823A |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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1N821 |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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1N823 |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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1N825A |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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IRC-PCM301LT-X |
ASM GmbH |
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miniatur-IR-temperatursensoren mit abgesetzter elektronik |
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1N825 |
Motorola, Inc |
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temperaturecompensated silicon zener reference diodes 6.2 V, 400 mW |
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67491-1137 |
Molex |
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1.27mm (.050") pitch serial ata high speed header, high temperaturethermoplastic, through hole, vertical, 7 circuits, 0.38??m (15??") gold (Au) plating, with2.35mm (.093") PC tail length, for 2.00mm (.079") pcb, lead-free |
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67491-1132 |
Molex |
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1.27mm (.050") pitch serial ata high speed header, high temperaturethermoplastic, through hole, vertical, 7 circuits, 0.38??m (15??") gold (Au) plating, with2.05mm (.081") PC tail length, for 1.60mm (.093") pcb, lead-free |
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67491-1131 |
Molex |
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1.27mm (.050") pitch serial ata high speed header, high temperaturethermoplastic, through hole, vertical, 7 circuits, 0.76??m (30??") gold (Au) plating, with2.05mm (.081") PC tail length, for 1.60mm (.093") pcb, lead-free |
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67491-1136 |
Molex |
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1.27mm (.050") pitch serial ata high speed header, high temperaturethermoplastic, through hole, vertical, 7 circuits, 0.76??m (30??") gold (Au) plating, with2.35mm (.093") PC tail length, for 2.00mm (.079") pcb, lead-free |
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67491-1135 |
Molex |
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1.27mm (.050") pitch serial ata high speed header, high temperaturethermoplastic, through hole, vertical, 7 circuits, gold (Au) flash plating, with 2.35mm(.093") PC tail length, for 2.00mm (.079") pcb, lead-free |
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U18-G03-D-K |
Unisonic Technologies |
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bipolar latch type hall-effect for high-temperarure operation |
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U18L-G03-D-K |
Unisonic Technologies |
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bipolar latch type hall-effect for high-temperarure operation |
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B57164-K474 |
Siemens Semiconductor Group |
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temperaturmessung bedrahtete scheiben |
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B57164-K682 |
Siemens Semiconductor Group |
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temperaturmessung bedrahtete scheiben |
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B57164-K683 |
Siemens Semiconductor Group |
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temperaturmessung bedrahtete scheiben |
